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NSR0530P2T5G Schottky Barrier Diode
Schottky barrier diodes are optimized for very low forward voltage drop and low leakage current and are used in a wide range of dc-dc converter, clamping and protection applications in portable devices. NSR0530P2 in a SOD-923 miniature package enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements.
Features
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* * * * * * * * * * * * * * * * *
Very Low Forward Voltage Drop - 370 mV @ 100 mA Low Reverse Current - 1.4 mA @ 10 V VR 500 mA of Continuous Forward Current Power Dissipation of 190 mW with Minimum Trace Very High Switching Speed Low Capacitance - CT = 10 pF This is a Pb-Free Device
2
30 V SCHOTTKY BARRIER DIODE
1 CATHODE
2 ANODE
Typical Applications
LCD and Keypad Backlighting Camera Photo Flash Buck and Boost dc-dc Converters Reverse Voltage and Current Protection Clamping & Protection
MARKING DIAGRAM
D 1 1 MG G
SOD-923 CASE 514AB PLASTIC
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Markets
Mobile Handsets MP3 Players Digital Camera and Camcorders Notebook PCs & PDAs GPS
D = Specific Device Code M = Month Code G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
Device NSR0530P2T5G Symbol VR IF ESD Value 30 500 Class 3B Class C Unit V mA Package SOD-923 (Pb-Free) Shipping 2 mm Pitch 8000/Tape & Reel
MAXIMUM RATINGS
Rating Reverse Voltage Forward Current (DC) ESD Rating: Human Body Model Machine Model
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
(c) Semiconductor Components Industries, LLC, 2008
1
April, 2008 - Rev. 0
Publication Order Number: NSR0530P2/D
NSR0530P2T5G
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance Junction-to-Ambient (Note 1) Total Power Dissipation @ TA = 25C Thermal Resistance Junction-to-Ambient (Note 2) Total Power Dissipation @ TA = 25C Junction and Storage Temperature Range Symbol RqJA PD RqJA PD TJ, Tstg Min Typ Max 520 190 175 570 -55 to +125 Unit C/W mW C/W mW C
1. Mounted onto a 4 in square FR-4 board 10 mm sq. 1 oz. Cu 0.06" thick single sided. Operating to steady state. 2. Mounted onto a 4 in square FR-4 board 1 in sq. 1 oz. Cu 0.06" thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Reverse Leakage (VR = 10 V) (VR = 30 V) Forward Voltage (IF = 10 mA) (IF = 100 mA) (IF = 500 mA) Total Capacitance (VR = 1.0 V, f = 1 MHz) Symbol IR 1.4 24 VF 0.28 0.37 0.52 10 10 200 0.37 0.46 0.62 V Min Typ Max Unit mA
CT
pF
10,000 IF, FORWARD CURRENT (mA) 1000 100 10 125C 1 0.1 85C 25C 0 0.1 -40C 0.2 0.3 0.4 0.5 0.6
1,000,000 100,000 Ir, REVERSE CURRENT (mA) 10,000 1000 100 10 1 0.1 0.01 0.001 0 5 10 15 20 25 30 35 VR, REVERSE VOLTAGE (V) -40C 125C 85C 25C
0.01
0.001
VF, FORWARD VOLTAGE (V)
Figure 1. Forward Voltage
20 CT, TOTAL CAPACITANCE (pF) 18 16 14 12 10 8 6 4 2 0 0 5 10 15 20 25 30 TA = 25C
Figure 2. Leakage Current
35
VR, REVERSE VOLTAGE (V)
Figure 3. Total Capacitance http://onsemi.com
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NSR0530P2T5G
PACKAGE DIMENSIONS
SOD-923 CASE 514AB-01 ISSUE B
D -X-YE
1 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.15 0.20 0.25 0.07 0.12 0.17 0.75 0.80 0.85 0.55 0.60 0.65 0.95 1.00 1.05 0.05 0.10 0.15 INCHES NOM 0.015 0.008 0.005 0.031 0.024 0.039 0.004
b
2X
0.08 (0.0032) X Y A
DIM A b c D E HE L MIN 0.013 0.006 0.003 0.030 0.022 0.037 0.002 MAX 0.016 0.010 0.007 0.033 0.026 0.041 0.006
c
L HE
SOLDERING FOOTPRINT*
0.90 0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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NSR0530P2/D

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